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HI-GD260 HEASTINK COMPOUND(1G)(GOLD)

Product Brand: Towel

The HI-GD260 Heatsink Compound (1g) (Gold) provides superior thermal conductivity and reliability, ensuring efficient heat dissipation for CPUs, GPUs, and other components. Easy to apply and highly compatible, this gold-colored thermal paste enhances cooling performance for demanding applications.

SKU TC/HT-GD260/1G Categories , Tag

RM2.00

5 in stock (can be backordered)

Product Descriptions

Enhance your thermal management with the HI-GD260 Heatsink Compound (1g) (Gold), a premium thermal paste designed to improve the efficiency of heat transfer between your processor and heatsink. Whether you’re a professional builder, an overclocking enthusiast, or simply looking to upgrade your PC’s cooling performance, this high-quality compound ensures optimal thermal conductivity and reliability.

Superior Thermal Conductivity: The HI-GD260 Heatsink Compound features advanced thermal conductivity properties, ensuring efficient heat dissipation from your CPU, GPU, or other critical components. The gold-colored compound provides excellent performance by filling microscopic imperfections on the contact surfaces, resulting in a more effective thermal interface and lower operating temperatures.

High Performance and Reliability: Engineered for both performance and durability, the HI-GD260 Heatsink Compound is designed to withstand high temperatures and long-term use without drying out or losing its effectiveness. This makes it an ideal choice for high-performance computing tasks, gaming, and other demanding applications where maintaining optimal thermal conditions is crucial.

Easy Application: Packaged in a convenient 1g syringe, the HI-GD260 Heatsink Compound is easy to apply precisely and cleanly. The syringe design allows for controlled application, minimizing waste and ensuring that you apply just the right amount of compound for the best thermal contact. Whether you’re a seasoned tech enthusiast or a beginner, you’ll find the application process straightforward and hassle-free.

Versatile Compatibility: The HI-GD260 Heatsink Compound is compatible with a wide range of cooling solutions and can be used with CPUs, GPUs, and other heatsink assemblies. Its versatility makes it suitable for desktops, laptops, and other electronic devices requiring efficient thermal management.

Gold Standard in Thermal Solutions: With its distinctive gold color, the HI-GD260 Heatsink Compound not only delivers top-notch performance but also adds a touch of sophistication to your build. Trust in this high-quality thermal paste to keep your components running cooler and more efficiently.

Upgrade your thermal management setup with the HI-GD260 Heatsink Compound (1g) (Gold) and enjoy enhanced cooling performance, reliability, and ease of use. Perfect for anyone looking to optimize their system’s thermal efficiency.

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Product Informations

Additional information

Colour

Gold

Thermal Conductivity

High

Type

Heatsink Compound

Application

electronic components, CPU/GPU cooling

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